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Plasma cleaning and activation

Concept

Removal of adsorbed gases, moisture, dust particles, organic and biological contaminants from the surface of parts, as well as imparting chemical activity to the surface through the action of atmospheric pressure plasma - high-energy ionized gas.

Purpose

Improving adhesion of adhesives, varnishes, rubber, paints, coatings, soldering quality, vacuum performance, activation and improvement of surface wettability. The method is used for cleaning and activation of metals, ceramics, glass, polymers and composites.

Physical Principles

• breaking chemical bonds of organic contaminant molecules, which are crushed, vaporized, and atomized;
• oxidation of organic molecules to form carbon dioxide and water vapor;
• formation of active oxygen particles of high concentration - ozone, providing an accelerated process of oxidation, splitting and atomization of organic substances;
• formation of hydrogen-containing reactive compounds that reduce oxides;
• interaction of chemically active polar OH and ON compounds with polymer molecules;
• effect of ultraviolet radiation on activation of the treated surface;
• cathodic cleaning of metals by arc discharge;
• creation of chemical bonds between long polymer molecules.

Benefits of the Process

• high rates of cleaning without the formation of solid sludge by breaking down and turning organic contaminants into gas vapors;
• lower content volatile organic substances such as solvent vapors, smoke or other monomers that may be toxic or allergic;
• destruction of biological contaminants and surface sterilization;
• gentle cleaning due to the use of localized surface contact with plasma as opposed to more coarse mechanical contact with solids or liquids;
• no use of liquid chemicals or complex, expensive vacuum equipment;
• the process can be integrated into existing production lines.

Application

Microelectronics, medical, automotive, aerospace, etc.